RELIABILITY OF SOLDER JOINTS IN
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UDK621.3:(53+54+621+66), ISSN0352-9045 Informacije MIDEM
RELIABILITY OF SOLDER JOINTS IN
ELECTRONIC PACKAGES
Dhafer Abdulameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin
Department of Mechanical Engineering, University of Malaya, Kuala Lumpur, Malaysia
Key words: Soldering, thermal cycling, drop impact, failure mode, material requirement
Abstract: Currently, the trend of miniaturization, light weight, high speed and multifunction are common in electronic assemblies, especially, for the
mobile electronics. One of the most critical aspects of the package reliability is solder joint reliability. So, in that field, thermal cycling and drop/impact
are the primary requirement for solder joint reliability. This paper discusses the reliability of solder joint in term of both temperature cycles load and drop/
impact load from view points of failure mode and relevant material properties. High compliance and high grain-coarsening resistance are identified as
key material properties for high thermal cycling and drop impact reliability respectively. The paper details the requirements solder joints have to meet to
be qualified for the mobile electronics applications. Therefore, this contribution has its value in giving information on suitable material electronic devices
under different loading condition.
Vpliv termičnih in fizičnih obremenitev na zanesljivost
spajkanih spojev v elektronskih vezjih
Kjučne besede: spajkanje, termične in fizične obremenitve, načini odpovedi, lastnosti materiala
Izvleček: Miniaturizacija, zmanjševanje teže, velika hitrost in večopravilnost so trenutni trend lastnosti elektronskih vezij, še posebej namenjenih mobil-
nim napravam. Eden najbolj kritičnih vidikov zanesljivosti elektronskega modula je zanesljivost spajkanega spoja. Le-ta mora biti odporen na termične in
fizične obremenitve. V prispevku obravnavamo zanesljivost spajkanega spoja ter vpliv materialnih lastnosti na vzroke odpovedi po termičnih in udarnih
obremenitvah. Naštejemo vse zahteve, ki jih zanesljiv spoj mora zadovoljevati, da zadosti kvalitetnim kriterijem za uporabo v elektronskih modulih namen-
jenih mobilnim napravam.
1. Introduction
An electronic package integrates metal conductors,
organic/ceramic dielectrics and semiconductors into a
functional device. This variety of materials results in a com-
plex system to build and, increasingly, retain high levels of
reliability. Reliability is influenced by the operation of the
device (e.g., power dissipated, current carried, etc.) and
the environment (e.g., ambient temperature, temperature
changes and imposed mechanical strains) (Frear et al.,
2008). Traditionally, only temperature and power cycling
were of concern for board level reliability, and coefficient of
thermal expansion mismatch between the package and the
board was considered as the primary failure mechanism.
However, due to the proliferation of electronic devices
across market segments, ranging from automotive to small,
hand-held devices; electronic packages experience me-
chanical loading conditions other than just temperature
cycling (Syed et al.). This additional failure mechanism has
their implications on package material selection to design
a robust package meeting reliability requirements for a
particular end use application.